Ever more powerful components are being packed into smaller and smaller spaces. Heat and power consumption are now critical elements of electronics design. Systems designers must minimize power consumption and waste heat. But with challenging thermal effects, they are working within conservative design margins. Thorough testing allows designers to push these boundaries and get the most out of the systems they design. Only those with the most effective testing solutions will succeed.

Electronic devices are getting smaller and more complex all the time. To pack more functionality into less space, system designers are utilizing System on a Chip (SoC) and System in Package (SiP). Wifi networking, cameras, interfaces, and power management systems are all being integrated into a single package or chip. The critical challenge is to improve performance and reduce power consumption. Those who have a test partner who understands their challenges will have the edge.

Consumers are demanding more from their devices, leading to longer replacement cycles and higher value products. Manufacturers face higher levels of risk, but the prize is far greater reward. But to bring premium products to market, makers will need to consider more capital investment in R&D. Quality is paramount at the top end of the market, so the winners will be those who have access to the best R&D equipment while maintaining capital for investment. They will need expert partners to achieve this.

Ever more powerful components are being packed into smaller and smaller spaces. Heat and power consumption are now critical elements of electronics design. Systems designers must minimize power consumption and waste heat. But with challenging thermal effects, they are working within conservative design margins. Thorough testing allows designers to push these boundaries and get the most out of the systems they design. Only those with the most effective testing solutions will succeed.